With its ultra-thin stacked chip-scale packaging (CSP), Intel can combine up to five memory chips in a stack just 1 millimeter high, substantially boosting memory while saving precious space inside phones and PDAs for other components.

Pushing the 1-Gig Threshold

As introduced, the new products will offer 256 megabits of flash memory, with capacity increasing to 512 megabits by the end of this year and to 1 gigabit by next year, according to Scott Dunagan, Intel's flash product marketing manager.

"This package offers a combination of high-density, high-performance and low-power memory in an extremely small form factor, providing the optimal solution for OEMs," he told NewsFactor. Cell phones with color displays require 64 megabits of flash, while a phone with a color screen and Java capability requires an average of 128 megabits of flash. Camera-enabled phones need up to 256 megabits of memory, Dunagan explained.

Memory stacking has taken the wireless-device industry by storm, said Dunagan, pointing out that that such packages now comprise 20 to 25 percent of Intel's flash business. The company has shipped 150 million stacked products since introducing them in 1999. The acknowledged leader in flash, Intel recently announced it has shipped its two-billionth flash memory unit.

Stacking Up

Along with StrataFlash wireless memory, Intel stacked-CSP products use an advanced wafer-thinning and package technology to obtain lower-profile heights and greater stacking flexibility. Mass production of the products is expected in the third quarter of 2003, with pricing established by specific flash and RAM memory combinations.

"This is novel packaging by Intel," Aberdeen Group analyst Russ Craig told NewsFactor. "They are creating the capability for substantial storage in a small space, which is critical for mobile devices like phones that are storing images, games and polyphonic ringtones."

Memory stacks also serve as an adjunct to the chip giant's push into the reduced power consumption processor market, Craig said.

Relieving Device Constraints

Memory constraints traditionally have been an obstacle to adding functions to phones and devices, Yankee Group analyst John Jackson told NewsFactor. "Phones can always use more memory, but there is always the cost factor since adding storage capacity can be expensive."

Still, Jackson said, Intel has developed a strong following among device manufacturers using the company's StrataFlash technology. "The memory stacks are an indication of what is happening with advances in silicon technologies, with greater memory density helping manufacturers pack more features into their handsets."

Pointing out that silicon integration is key in the latest handheld devices, Dunagan said Intel also plans to combine logic with flash and other memory devices.